Effect Of Reflow Soldering On The IMC And Shear Strength Of Sn-0.3Ag-0.7Cu-XBi/Cu Solder JointsAttention Questions And Measures During BGA Assembly Were Analyzed To Increase BGA Assembly Quality By BGA Package,PCB Design,Solder Paste Print,Place BGA,And Reflow Soldering Process
Xiangyang Hongshida Co., Ltd.
- Phone: +86 00-13002392641
- Business Type: Trading Company
- Location: China
- Main Products: Auto Parts Cloakroom set hardware Electronic products, wood, bamboo products, clothing
- Total Employees:Less than 100 people
- Year Established:
- Export Markets:South America,Asia,Europe
- Total Annual Revenue:
