Low price/factory Outlet/Semiconductor equipment and process solutions/vacuum eutectic reflow furnace

Key attributes

Other attributes

Condition

New

Applicable Industries

Manufacturing Plant, Energy & Mining

Showroom Location

Canada, United Kingdom, United States, France, Germany, Viet Nam, Indonesia, India, Russia, South Korea, Japan, Malaysia

Video outgoing-inspection

Provided

Machinery Test Report

Provided

Marketing Type

New Product 2020

Warranty of core components

2 years

Core Components

PLC

Place of Origin

Guangdong, China

Warranty

2 years

Key Selling Points

Competitive Price

Weight (KG)

120 KG

Type

Reflow Solder

Brand Name

minderpack

Usage

Semiconductor equipment and process

After Warranty Service

Online support

After-sales Service Provided

Free spare parts

Certification

ce

Packaging & delivery

Package Type:

Reflow soldering

Supply Ability

100 Set/Sets per Month

Product Description

Introduction to vacuum reflow eutectic soldering:

1.  This kind of reflow soldering is performed in a real vacuum environment;
2.  It must be soldered with the help of low-activity flux;
3.  A good operating experience can be achieved through professional software control and touch screen control;
4.  With a programmable temperature control system, you can also set a better process curve;
5.  The temperature setting of the machine adopts a touch-type lifting mode, which can directly pull the curve by hand, so that a  process closer to the process curve of the welding material can be set;

6.   Water cooling technology can achieve the fastest cooling effect in the industry;
7.   Four groups of on-line temperature measurement functions can realize the accurate measurement of uniform temperature in the  welding area;
8.   Formic acid, nitrogen, etc. can be selected to meet the requirements of special welding processes;
9.   The PLC control system of the equipment can well monitor the vacuum, inflatable body, heating control, and water cooling  operations;
10.  The top cover of the cranial cavity of the device is also equipped with an observation window, which is convenient for the staff to observe.

Application fields of vacuum reflow eutectic welding:

Fiber optic devices, MEMS devices, deep ultraviolet eutectic patches, sensors, optoelectronic device packaging, hybrid circuit packaging, Wafer Bonding, laser package welding, thermistor packaging, IGBT/IPM modules, LED automotive headlights, hybrid microelectronic circuits.

The vacuum eutectic reflow furnace is a device that uses the principle of vacuum heating to provide a process environment for the alloy solder of electronic components.

LED chip welding, MEMS device packaging, LD device welding, electronic and electronic device packaging, IGBT chip welding, tube case cover, etc.

Specification